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Employer: Sony Group Corporation Japan
*You MUST apply by October 16th, 11:59 PM Japan Standard Time through our website (here: https://www.sony.com/en/SonyInfo/Careers/japan/), NOT through Handshake. We will not review Handshake applications.*Please refer to our website linked above for more detailed information about the role below, including job responsibilities, required/preferred qualifications, and links to submit an application.Position SummaryThe finite element method (FEM) is most frequently used for a simulation for analyzing the deformation. While it is accurate for the small deformation, it has some disadvantages, for example, that the calculation does not converge for large deformation such as elastomers or thin films. To solve this problem, we are focusing on a new method called Material Point Method (MPM) that can analyze flexible materials or large deformation, which is difficult to analyze by FEM. Currently we are developing it to apply it to the future product design, for example, human interface of VR/AR glasses, headphones/earphones, soft robotics or flexible or thin materials. Our focus points for MPM are processing acceleration, accuracy verification, and add-in function development for an open-source software, such as ParaView.*Note that internship start and end dates are flexible, and that most will commence in late spring/early summer 2023.